"When the AP [advanced packaging] facility opens, Intel Malaysia will be equipped to undertake a full suite of semiconductor activities except wafer fabrication – its only overseas operation with such wide spectrum of capabilities. This is probably the reason the tour is hosted in Malaysia."

https://www.techgoondu.com/2023/09/07/an-inside-look-at-intels-malaysia-chip-assembly-and-test-operations/

#Malaysia #Intel #Fabrication #ICs #Technololy #Engineering